
DEIE International Scholarships
Higher Education Loans and Scholarships Board (HELSB)
Job Description
DEIE International Scholarships – Universitas Gadjah Mada (UGM), Indonesia and Higher Education Loans and Scholarships Board (HELSB)
Organization: Higher Education Loans and Scholarships Board (HELSB) / Universitas Gadjah Mada (UGM)
Institution: Department of Electrical and Information Engineering (DEIE), Faculty of Engineering, Universitas Gadjah Mada
Location: Yogyakarta, Indonesia
Programme Level: Master's and Doctoral Programmes
About the Scholarship
The Higher Education Loans and Scholarships Board (HELSB) is informing suitably qualified Zambian graduates about international scholarship opportunities offered by the Department of Electrical and Information Engineering (DEIE) at Universitas Gadjah Mada (UGM), Indonesia.
Universitas Gadjah Mada is one of Indonesia's leading universities and is ranked among the world's top universities. The scholarship is designed for outstanding international students wishing to pursue advanced studies and research in Electrical Engineering and Information Technology.
Available Programmes
Applicants may apply for the following programmes:
Master's Programme in Electrical Engineering
Master's Programme in Information Technology
Doctoral Programme in Electrical Engineering
Scholarship Benefits
Successful applicants will receive:
Full tuition fee coverage.
Dormitory accommodation located near the university and public transport.
Monthly living allowance of IDR 3,000,000 (approximately USD 166, subject to prevailing exchange rates), payable to one scholarship recipient.
Please Note
The scholarship does not cover:
Student visa fees.
Round-trip airfare.
Health insurance.
Travel insurance.
Research Areas
Successful candidates may undertake research in areas including:
Artificial Intelligence
Renewable Energy
Power Systems
Robotics and Autonomous Systems
Cybersecurity
Human–Computer Interaction
Intelligent Systems
Biomedical Engineering
Blockchain Technologies
Virtual, Augmented and Extended Reality (VR/AR/XR)
Digital Transformation and Industrial Automation
Application Requirements
Applicants should submit the following:
Degree Certificate:
Bachelor's Degree (Master's applicants).
Bachelor's and Master's Degrees (Doctoral applicants).
Academic Transcript (minimum GPA of 3.25/4.00).
Curriculum Vitae (CV).
Cover Letter.
Letter of Recommendation.
Passport biodata page.
Thesis/Dissertation Research Proposal.
English language proficiency results:
TOEFL ITP (minimum 500), or
IELTS (minimum 5.5), or
TOEFL iBT (minimum 61), or
Duolingo English Test (minimum 100).
Applicants who do not yet possess English proficiency results may upload a signed statement confirming their willingness to submit the required English test results upon selection.
Application Timeline (Spring Semester – February Intake)
Registration: 1–31 July
Administrative Selection: 1–15 August
Interviews: 16–25 August
Results Announcement: 31 August
HELSB is only disseminating this scholarship opportunity. Applicants are advised to carefully review the scholarship terms and conditions, particularly the costs not covered by the scholarship, before submitting their applications.
Scholarship Summary
Institution: Universitas Gadjah Mada (UGM), Indonesia
Department: Department of Electrical and Information Engineering (DEIE)
Programme Levels: Master's and Doctoral Programmes
Scholarship Coverage: Tuition, dormitory accommodation, and monthly living allowance
Application Period: Registration open from 1–31 July
Website: Website: http://ugm.id/deiescholarship
Email: teti@ugm.ac.id
How to Apply
- Click the Apply on Website button above.
- You will be redirected to the employer's website.
- Read the application instructions carefully.
- Complete the online application form.
- Upload your Curriculum Vitae (CV) with at least two professional referees and all required documents.
- Submit your application before the deadline.
- Note: Only shortlisted candidates will be contacted.
Important Notice
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